PowerColor Radeon RX 9060 XT Reaper 16GB GDDR6 PCI-Express Graphics Card
$6,000.00
Boost Clock: 3230 MHz, Memory: 16GB 20000MHz GDDR6, Stream Processors: 2048, RDNA 4, 4nm Process, AMD FidelityFX Super Resolution 4
Product Description
GPU Direct-Contact Copper Plate Dual Fan
A large copper plate provides direct contact with the GPU while covering the VRAM area to increase the heat transfer threshold to the max.
A 2 x 90mm optimized fan design to maintain your card in the best cooling solution.
Intelligent Fan Controller Back Plate
Utilizing temperature detection from a smart chip, fans will start running when the GPU reaches 60°C and shut down below 50°C.
The metal back plate is extremely rigid to strengthen the card to prevent PCB bending.
AMD Radeon™ Anti-Lag 2* & AMD RDNA™ 4 Architecture
Ultra-low-latency gaming, and when combined with AMD FSR advanced frame generation, it delivers ultra-smooth, ultra-responsive high FPS experiences.
New AMD RDNA™ 4 architecture features 3rd Gen raytracing and 2nd Gen AI accelerators to deliver the performance you need to max out your gaming.
Specification
Details
EAN CODE
4713436175964
Bus Standard
PCIE 5.0 x16
Graphics Engine
RX9060XT 16G-A
Display Connectors
1 x HDMI 2.1b, 2 x DisplayPort 2.1a
Video Memory
16GB GDDR6
Form Factor
ATX
Stream Processor
2048 Units
Cooler
2 Slot Dual Fan
Game Clock
2620 MHz
Power Connector
One 8-pin PCI Express Power Connector
Engine Clock Boost
3230 MHz
OpenGL
4.6
DirectX® Support
12
Memory Speed
20.0 Gbps
Minimum System Power
500W
Memory Interface
128 bits
Card Dimension (mm)
200 x 100 x 39 mm
220 x 120 x 40 mm (with bracket)
Accessories Bundle
Gaming Gear Intro Card
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
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